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Intel has formally joined Elon Musk's Terafab semiconductor project, announced in April 2026, contributing its 18A process technology and decades of fabrication experience to the ambitious vertically integrated chip facility planned for Texas.

Scientists from the University of Ottawa and MIT review more than 20 years of research and identify pathways to room-temperature devices that could make electronics faster and more energy efficient.

Researchers at MIT have invented a transistor using magnetic materials instead of silicon, promising smaller, faster, and more energy-efficient electronic circuits.

Researchers at TU Wien create a silicon-germanium transistor by doping the oxide layer, leading to smaller, faster devices that save energy and suit quantum chips.

Engineers have found ways to layer high-quality semiconductor layers directly on top of each other to build 3D chips.

Researchers use a precise helium ion beam to introduce controlled defects into aluminum nitride, turning it into a ferroelectric material for low-power data storage with existing chip manufacturing tools.

Researchers at the University of Southern California develop a memristor that functions at 700 degrees Celsius, far beyond the limits of conventional electronics.

A layered material transforms under pressure, offering energy-efficient, fast data storage for future computers.